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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
P0402FC08C8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cardsdistributorSOIC16-55°C150°C180 K
P0404FC08C8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cardsdistributorSOIC16-55°C150°C176 K
P0406FC08C8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cardsdistributorSOIC16-55°C150°C181 K
P0408FC08C8.0V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cardsdistributorSOIC16-55°C150°C185 K
PKFC08C8.0V; 250Watts; packed flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C102 K
PSLC08C8.0V; 350Watt; low capacitance TVS array. For ethernet- 10/100 base T, cellular phones, audio & video inputs, firewire, SCSI & USB interfacesdistributor-4-55°C150°C206 K
SM16LC08C8.0V; 500Watt; low capacitance TVS array. For wireless communication circuits, RS-422/432/485, low voltage ASICs, ethernet- 10/100 base TdistributorSOIC16-55°C150°C169 K
U0402FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C162 K
U0404FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C107 K
U0406FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
U0406FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
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