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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AS4LC1M16E5-50TC3V 1M x 16 CM0S DRAM (EDO), 50ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII500°C70°C604 K
AS4LC1M16E5-50TC3V 1M x 16 CM0S DRAM (EDO), 50ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII440°C70°C604 K
AS4LC1M16E5-50TI3V 1M x 16 CM0S DRAM (EDO), 50ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII50-40°C85°C604 K
AS4LC1M16E5-50TI3V 1M x 16 CM0S DRAM (EDO), 50ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII44-40°C85°C604 K
AS4LC1M16E5-60JC3V 1M x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-Corporationplastic SOJ420°C70°C604 K
AS4LC1M16E5-60JI3V 1M x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-Corporationplastic SOJ42-40°C85°C604 K
AS4LC1M16E5-60TC3V 1M x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII500°C70°C604 K
AS4LC1M16E5-60TC3V 1M x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII440°C70°C604 K
AS4LC1M16E5-60TI3V 1M x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII50-40°C85°C604 K
AS4LC1M16E5-60TI3V 1M x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-Corporationplastic TSOPII44-40°C85°C604 K
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