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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AS4LC256K16E0-60JC3.3V 256K x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-Corporationplastic SOJ400°C70°C528 K
AS4LC256K16E0-60TC3.3V 256K x 16 CM0S DRAM (EDO), 60ns RAS access timeAlliance-Semiconductor-CorporationTSOPII440°C70°C528 K
AS7C256-10JC5V 32K x 8 CM0S SRAM (common I/O), 10ns access timeAlliance-Semiconductor-Corporationplastic SOJ280°C70°C133 K
AS7C256-10JI5V 32K x 8 CM0S SRAM (common I/O), 10ns access timeAlliance-Semiconductor-Corporationplastic SOJ28-40°C85°C133 K
AS7C256-10PC5V 32K x 8 CM0S SRAM (common I/O), 10ns access timeAlliance-Semiconductor-CorporationPDIP280°C70°C133 K
AS7C256-10TC5V 32K x 8 CM0S SRAM (common I/O), 10ns access timeAlliance-Semiconductor-Corporationplastic TSOP280°C70°C133 K
AS7C256-10TI5V 32K x 8 CM0S SRAM (common I/O), 10ns access timeAlliance-Semiconductor-Corporationplastic TSOP28-40°C85°C133 K
AS7C256-12JC5V 32K x 8 CM0S SRAM (common I/O), 12ns access timeAlliance-Semiconductor-Corporationplastic SOJ280°C70°C133 K
AS7C256-12JI5V 32K x 8 CM0S SRAM (common I/O), 12ns access timeAlliance-Semiconductor-Corporationplastic SOJ28-40°C85°C133 K
AS7C256-12PC5V 32K x 8 CM0S SRAM (common I/O), 12ns access timeAlliance-Semiconductor-Corporationplastic DIP280°C70°C133 K
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