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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AS7C256-12TC5V 32K x 8 CM0S SRAM (common I/O), 12ns access timeAlliance-Semiconductor-Corporationplastic TSOP280°C70°C133 K
AS7C256-12TI5V 32K x 8 CM0S SRAM (common I/O), 12ns access timeAlliance-Semiconductor-Corporationplastic TSOP28-40°C85°C133 K
AS7C256-15JC5V 32K x 8 CM0S SRAM (common I/O), 15ns access timeAlliance-Semiconductor-Corporationplastic SOJ280°C70°C133 K
AS7C256-15JC5V 32K x 8 CM0S SRAM (common I/O), 15ns access timeAlliance-Semiconductor-Corporationplastic SOJ280°C70°C133 K
AS7C256-15JI5V 32K x 8 CM0S SRAM (common I/O), 15ns access timeAlliance-Semiconductor-Corporationplastic SOJ28-40°C85°C133 K
AS7C256-15PC5V 32K x 8 CM0S SRAM (common I/O), 15ns access timeAlliance-Semiconductor-Corporationplastic DIP280°C70°C133 K
AS7C256-15TC5V 32K x 8 CM0S SRAM (common I/O), 15ns access timeAlliance-Semiconductor-Corporationplastic TSOP280°C70°C133 K
AS7C256-15TI5V 32K x 8 CM0S SRAM (common I/O), 15ns access timeAlliance-Semiconductor-Corporationplastic TSOP28-40°C85°C133 K
AS7C256-20JC5V 32K x 8 CM0S SRAM (common I/O), 20ns access timeAlliance-Semiconductor-Corporationplastic SOJ280°C70°C133 K
AS7C256-20PC5V 32K x 8 CM0S SRAM (common I/O), 20ns access timeAlliance-Semiconductor-Corporationplastic DIP280°C70°C133 K
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