Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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M27C512-10C3TR | 512 Kbit (64Kb x 8) EPROM, 5V, 100ns | SGS-Thomson-Microelectronics | PLCC | 32 | -40°C | 125°C | 114 K |
M27C512-10XC3TR | 512 Kbit (64Kb x 8) EPROM, 5V, 100ns | SGS-Thomson-Microelectronics | PLCC | 32 | -40°C | 125°C | 114 K |
M27C512-12XC3TR | 512 Kbit (64Kb x 8) EPROM, 5V, 120ns | SGS-Thomson-Microelectronics | PLCC | 32 | -40°C | 125°C | 114 K |
M27C512-15C3TR | 512 Kbit (64Kb x 8) EPROM, 5V, 150ns | SGS-Thomson-Microelectronics | PLCC | 32 | -40°C | 125°C | 114 K |
M27C512-90C3TR | 512 Kbit (64Kb x 8) EPROM, 5V, 90ns | SGS-Thomson-Microelectronics | PLCC | 32 | -40°C | 125°C | 114 K |
M27C512-90XC3TR | 512 Kbit (64Kb x 8) EPROM, 5V, 90ns | SGS-Thomson-Microelectronics | PLCC | 32 | -40°C | 125°C | 114 K |
RD28F3204C3T70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F3204C3T70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F3208C3T90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
RD28F3208C3T90 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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