| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| CD40174BCM | Hex D-Type Flip-Flop | Fairchild-Semiconductor | SOIC | 16 | - | - | 58 K |
| CD40174BCMX | Hex D-Type Flip-Flop | Fairchild-Semiconductor | SOIC | 16 | - | - | 58 K |
| CD40174BCN | Hex D-Type Flip-Flop | Fairchild-Semiconductor | MDIP | 16 | - | - | 58 K |
| CD40174BMS | Radiation Hardened CMOS Hex `D-Type Flip-Flop | Intersil-Corporation | - | - | - | - | 70 K |
| CD40174BPW | CMOS HEX D-TYPE FLIP-FLOP | Texas-Instruments | PW | 16 | -55°C | 125°C | 215 K |
| CD40174BPW | CMOS HEX D-TYPE FLIP-FLOP | Texas-Instruments | PW | 16 | -55°C | 125°C | 215 K |
| CD40174BPWR | CMOS HEX D-TYPE FLIP-FLOP | Texas-Instruments | PW | 16 | -55°C | 125°C | 215 K |
| [1] 2 |
|---|
