Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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D2003UK | 28V, 5W, 1MHz-1GHz push-pull RF | Semelab-Plc- | DQ | - | - | - | 60 K |
D2004UK | 28V, 10W, 1MHz-1GHz push-pull RF | Semelab-Plc- | DK | - | - | - | 51 K |
D2006UK | 28V, 15W, 1MHz-1GHz push-pull RF | Semelab-Plc- | DK | - | - | - | 16 K |
FAR-F6CP-1G4890-D208-V | Piezoelectric SAW BPF(700 to 1700 MHz) | Fujitsu-Microelectronis | - | 4 | -30°C | 85°C | 230 K |
FAR-F6CP-1G4890-D208-U | Piezoelectric SAW BPF(700 to 1700 MHz) | Fujitsu-Microelectronis | - | 4 | -30°C | 85°C | 230 K |
FAR-F6CP-1G4890-D208-W | Piezoelectric SAW BPF(700 to 1700 MHz) | Fujitsu-Microelectronis | - | 4 | -30°C | 85°C | 230 K |
MB84VD2002-10 | MCP (multi-chip package) flash memory & SRAM 8M(x8/x16) flash memory & 2M(x8) static RAM | Fujitsu-Microelectronis | plastic FBGA | 48 | -20°C | 85°C | 423 K |
MB84VD2003-10 | MCP (multi-chip package) flash memory & SRAM 8M(x8/x16) flash memory & 2M(x8) static RAM | Fujitsu-Microelectronis | plastic FBGA | 48 | -20°C | 85°C | 423 K |
MB84VD2008-10 | MCP (multi-chip package) flash memory & SRAM 8M(x16) flash memory & 2M(x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 48 | -20°C | 85°C | 393 K |
MB84VD2009-10 | MCP (multi-chip package) flash memory & SRAM 8M(x16) flash memory & 2M(x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 48 | -20°C | 85°C | 393 K |
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