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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
1.5KCD22CTransient Voltage SuppressorMicrosemi-CorporationCELLULAR_DIE---123 K
14KESD22ATransient Voltage SuppressorMicrosemi-Corporation----109 K
MB84VD2218XEC-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAMFujitsu-Microelectronisplastic BGA73-25°C85°C1 M
MB84VD2218XEE-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAMFujitsu-Microelectronisplastic BGA73-25°C85°C1 M
MB84VD2219XEC-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAMFujitsu-Microelectronisplastic BGA73-25°C85°C1 M
MB84VD2219XEE-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAMFujitsu-Microelectronisplastic BGA73-25°C85°C1 M
MCD221FUCD-interface and audio processorMotorolaQFP800°C70°C187 K
MLL1.4KESD22ATransient Voltage SuppressorMicrosemi-Corporation----118 K
MLL14KESD22ATransient Voltage SuppressorMicrosemi-Corporation----119 K
MOCD223Dual channel small outline optoisolatorMotorolaSOIC8-55°C100°C112 K
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