Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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1.5KCD22C | Transient Voltage Suppressor | Microsemi-Corporation | CELLULAR_DIE | - | - | - | 123 K |
14KESD22A | Transient Voltage Suppressor | Microsemi-Corporation | - | - | - | - | 109 K |
MB84VD2218XEC-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
MB84VD2218XEE-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
MB84VD2219XEC-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
MB84VD2219XEE-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
MCD221FU | CD-interface and audio processor | Motorola | QFP | 80 | 0°C | 70°C | 187 K |
MLL1.4KESD22A | Transient Voltage Suppressor | Microsemi-Corporation | - | - | - | - | 118 K |
MLL14KESD22A | Transient Voltage Suppressor | Microsemi-Corporation | - | - | - | - | 119 K |
MOCD223 | Dual channel small outline optoisolator | Motorola | SOIC | 8 | -55°C | 100°C | 112 K |
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