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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
AD28MSP01KN0.3-7V; PSTN signal port. High performance DSP-based modems V.32ter, V32bis, V.32, V.22bis, V.22, V.21 bell 212A, 103 fax and cellular-compatible modems V.33, V.29, V.27ter, V.27bis, V.27, V.26bis integrated fax, modem and speech processingAnalog-DevicesDIP280°C70°C368 K
AD28MSP01KR0.3-7V; PSTN signal port. High performance DSP-based modems V.32ter, V32bis, V.32, V.22bis, V.22, V.21 bell 212A, 103 fax and cellular-compatible modems V.33, V.29, V.27ter, V.27bis, V.27, V.26bis integrated fax, modem and speech processingAnalog-DevicesSOIC280°C70°C368 K
AD28MSP01KST0.3-7V; PSTN signal port. High performance DSP-based modems V.32ter, V32bis, V.32, V.22bis, V.22, V.21 bell 212A, 103 fax and cellular-compatible modems V.33, V.29, V.27ter, V.27bis, V.27, V.26bis integrated fax, modem and speech processingAnalog-DevicesTQFP440°C70°C368 K
AD28MSP02KN0.3-7V; voiceband signal portAnalog-DevicesDIP240°C70°C330 K
KSD288NPN Epitaxial Silicon TransistorFairchild-Semiconductor----42 K
KTD2854Darlington TransistorKorea-Electronics-Co--Ltd-----88 K
MMBD2838Small Signal DiodeFairchild-Semiconductor----58 K
RD28F3204C3B7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3204C3B7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3204C3B7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3204C3B7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3204C3T7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3204C3T7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
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