| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| AP1117D28A | 2.8V 1A positive low dropout regulator | distributor | - | 3 | 0°C | 70°C | 186 K |
| MMBD2837LT1 | 30 V, monolithic dual switching diode | distributor | - | 3 | -55°C | 150°C | 54 K |
| MMBD2838LT1 | 50 V, monolithic dual switching diode | distributor | - | 3 | -55°C | 150°C | 54 K |
| PMBD2835 | 85 V, high-speed double diode | Philips-Semiconductors | SOT | 3 | - | - | 43 K |
| PMBD2837 | 35 V, high-speed double diode | Philips-Semiconductors | SOT | 3 | - | - | 43 K |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1602C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3BD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3B70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F3208C3T70 | 32-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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