| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| LD511 | Compression amplifier class A, 2.4V DC | Gennum-Corporation | MICROpac | 10 | -10°C | 40°C | 90 K |
| LD511 | Compression amplifier class A, 2.4V DC | Gennum-Corporation | MINIpac | 10 | -10°C | 40°C | 90 K |
| LD511 | Compression amplifier class A, 2.4V DC | Gennum-Corporation | PLID | 10 | -10°C | 40°C | 90 K |
| LD511 | Compression amplifier class A, 2.4V DC | Gennum-Corporation | SLT | 10 | -10°C | 40°C | 90 K |
| LD511 | Compression amplifier class A, 2.4V DC | Gennum-Corporation | Chip | - | -10°C | 40°C | 90 K |
| MD51V65165-60TA | 4,194,304-word x 16-bit dynamic RAM | distributor | TSOP | 50 | 0°C | 70°C | 343 K |
| MD51V65805-50JA | 8,388,608-word x 8-bit dynamic RAM | distributor | SOJ | 32 | 0°C | 70°C | 312 K |
| MD51V65805-50TA | 8,388,608-word x 8-bit dynamic RAM | distributor | TSOP | 32 | 0°C | 70°C | 312 K |
| MD51V65805-60JA | 8,388,608-word x 8-bit dynamic RAM | distributor | SOJ | 32 | 0°C | 70°C | 312 K |
| MD51V65805-60TA | 8,388,608-word x 8-bit dynamic RAM | distributor | TSOP | 32 | 0°C | 70°C | 312 K |
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