Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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GD80960JA-16 | 3.3 V embedded 32-bit microprocessor. 16 MHz | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
GD80960JA-25 | 3.3 V embedded 32-bit microprocessor. 25 MHz | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
GD80960JA-33 | 3.3 V embedded 32-bit microprocessor. 33 MHz | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
GD80960JD-33 | 3.3 V embedded 32-bit microprocessor. 33 MHz core, 16 MHz bus | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
GD80960JD-40 | 3.3 V embedded 32-bit microprocessor. 40 MHz core, 20 MHz bus | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
GD80960JF-16 | 3.3 V embedded 32-bit microprocessor. 16 MHz | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
GD80960JF-25 | 3.3 V embedded 32-bit microprocessor. 25 MHz | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
GD80960JF-33 | 3.3 V embedded 32-bit microprocessor. 33 MHz | Intel-Corporation | MPBGA | 196 | 0°C | 100°C | 835 K |
MBM29DL324BD80PBT | CMOS 32M (4M x 8/2M x16) bit dual operation | Fujitsu-Microelectronis | plastic FBGA | 57 | -20°C | 70°C | 1 M |
MBM29DL324BD80PFTN | CMOS 32M (4M x 8/2M x16) bit dual operation | Fujitsu-Microelectronis | plastic TSOP | 48 | -20°C | 70°C | 1 M |
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