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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
MB84VD2218XEC-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAMFujitsu-Microelectronisplastic BGA73-25°C85°C1 M
MB84VD2219XEC-90-PBSStacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAMFujitsu-Microelectronisplastic BGA73-25°C85°C1 M
QEC123Plastic Infrared Light Emitting Diode. 880 nm AlGaAsdistributor----436 K
S-80748AL-EC-SHigh-precision voltage detectorSeiko-Epson-Corporation-3-30°C80°C2 M
S-80748AL-EC-T1High-precision voltage detectorSeiko-Epson-Corporation-3-30°C80°C2 M
S-80748AL-EC-T2High-precision voltage detectorSeiko-Epson-Corporation-3-30°C80°C2 M
S-80848ALNP-EEC-T2 Low-voltage high-precision voltage detectorSeiko-Epson-Corporation-4-40°C85°C1 M
S-875023BUP-AEC-T2High-withstand-voltage voltage regulator with reset functionSeiko-Epson-Corporation-5-40°C85°C1 M
TSB80L188EC1316-bit high-integration embedded processor. 13 MHz, 3 VIntel-CorporationSQFP100-40°C85°C790 K
TSB80L188EC1616-bit high-integration embedded processor. 16 MHz, 3 VIntel-CorporationSQFP100-40°C85°C790 K
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