Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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AM29F160BB-90WCCB | 16 megabit CMOS 3.0 volt-only boot sector flash memory | AMD-Advanced-Micro-Devices | FBGA | 52 | -55°C | 125°C | 649 K |
GT28F160B3-B120 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 120 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 427 K |
GT28F160B3-B150 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 150 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 427 K |
GT28F160B3-T120 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 120 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 427 K |
GT28F160B3-T150 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 150 ns | Intel-Corporation | microBGA | 48 | -40°C | 85°C | 427 K |
TE28F160B3-B120 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 120 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 427 K |
TE28F160B3-B150 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 150 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 427 K |
TE28F160B3-T120 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 120 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 427 K |
TE28F160B3-T150 | Smart 3 advanced boot block 16-Mbit (1024K x 16) flash memory. Access speed 150 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 427 K |
TE28F160B3TA90 | Smart 3 advanced boot block 16-Mbit flash memory family. Access speed 90 ns | Intel-Corporation | TSOP | 48 | -40°C | 85°C | 300 K |
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