Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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K9F1608W0A-TCB0 | 2M x 8 bit NAND flash memory | Samsung-Electronic | TSOP II | 40 | 0°C | 70°C | 443 K |
K9F1608W0A-TIB0 | 2M x 8 bit NAND flash memory | Samsung-Electronic | TSOP II | 40 | -40°C | 85°C | 443 K |
N74F1604D | 5.5 V, latch | Philips-Semiconductors | SOL | 28 | 0°C | 70°C | 92 K |
N74F1604N | 5.5 V, latch | Philips-Semiconductors | DIP | 28 | 0°C | 70°C | 92 K |
QL16x24B-0CF160I | Very-high-speed CMOS FPGA, pASIC1 family. | distributor | CQFP | 160 | -40°C | 85°C | 1 M |
QL16x24B-1CF160C | Very-high-speed CMOS FPGA, pASIC1 family. | distributor | CQFP | 160 | 0°C | 70°C | 1 M |
QL16x24B-1CF160I | Very-high-speed CMOS FPGA, pASIC1 family. | distributor | CQFP | 160 | -40°C | 85°C | 1 M |
QL16x24B-2CF160C | Very-high-speed CMOS FPGA, pASIC1 family. | distributor | CQFP | 160 | 0°C | 70°C | 1 M |
QL16x24B-2CF160I | Very-high-speed CMOS FPGA, pASIC1 family. | distributor | CQFP | 160 | -40°C | 85°C | 1 M |
TDF1607DP | Interface circuit - relay and lamp-driver | SGS-Thomson-Microelectronics | DIP | 8 | -40°C | 85°C | 444 K |
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