Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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M38C20FB-FP | RAM size:192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 64 | -20°C | 85°C | 1000 K |
M38C20FB-HP | RAM size:192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 64 | -20°C | 85°C | 1000 K |
M38C20FB-HP | RAM size:192 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 64 | -20°C | 85°C | 1000 K |
M38C21FB-HP | RAM size:256 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 64 | -20°C | 85°C | 1000 K |
MH32S64APFB-7 | 2147483648-bit (33554432-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 144 | 0°C | 70°C | 700 K |
MH32S64APFB-7 | 2,147,483,648-bit (33,554,432-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 700 K |
MH32S64APFB-8 | 2,147,483,648-bit (33,554,432-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | - | 0°C | 70°C | 700 K |
MH32S64APFB-8 | 2147483648-bit (33554432-word by 64-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 144 | 0°C | 70°C | 700 K |
MH8S72BBFB-7 | 603979776-bit (8388608-word by 72-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSSOP | 168 | 0°C | 70°C | 733 K |
MH8S72BBFB-8 | 603979776-bit (8388608-word by 72-bit) synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSSOP | 168 | 0°C | 70°C | 733 K |
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