| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 7206FRPFB20 | High-speed epi-CMOS (16K x 9-bit) parallel FIFO | distributor | Flatpack | 28 | -55°C | 125°C | 208 K |
| FFB2222A | NPN Multi-Chip General Purpose Amplifier | Fairchild-Semiconductor | - | 6 | - | - | 61 K |
| FFB2907A | PNP Multi-Chip General Purpose Amplifier | Fairchild-Semiconductor | - | 6 | - | - | 62 K |
| IRFB23N15D | HEXFET power MOSFET. VDSS = 150V, RDS(on) = 0.090 Ohm, ID = 23A | International-Rectifier | - | 3 | -55°C | 175°C | 139 K |
| IRFB23N20D | HEXFET power MOSFET. VDSS = 200V, RDS(on) = 0.10 Ohm, ID = 24A | International-Rectifier | - | 3 | -55°C | 175°C | 196 K |
| IRFB260N | HEXFET power MOSFET. VDSS = 200V, RDS(on) = 0.040 Ohm, ID = 56A | International-Rectifier | - | 3 | -55°C | 175°C | 90 K |
| SVFB21D225M | Resign molded chip fuse built-in | NEC-Electronics-Inc- | - | - | - | - | 142 K |
| SVFB21E155M | Resign molded chip fuse built-in | NEC-Electronics-Inc- | - | - | - | - | 142 K |
| SVFB21V105M | Resign molded chip fuse built-in | NEC-Electronics-Inc- | - | - | - | - | 142 K |
| UFB2.5 | High Voltage Rectifier | Microsemi-Corporation | DH | - | - | - | 136 K |
| [1] [2] 3 [4] [5] [6] [7] [8] [9] |
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