Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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LC0402FC08C | 8.0V; 200W; low capacitance flip chip array. For notebook computers, cellular phones, personal digital assistant (PDA), SMART cards | distributor | - | - | -55°C | 150°C | 166 K |
LC0404FC08C | 8.0V; 200W; low capacitance flip chip array. For notebook computers, cellular phones, personal digital assistant (PDA), SMART cards | distributor | - | - | -55°C | 150°C | 170 K |
LC0406FC08C | 8.0V; 200W; low capacitance flip chip array. For notebook computers, cellular phones, personal digital assistant (PDA), SMART cards | distributor | - | - | -55°C | 150°C | 176 K |
LC0408FC08C | 08.0V; 200W; low capacitance flip chip array. For notebook computers, cellular phones, personal digital assistant (PDA), SMART cards | distributor | - | - | -55°C | 150°C | 180 K |
P0402FC08C | 8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 180 K |
P0404FC08C | 8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 176 K |
P0406FC08C | 8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 181 K |
P0408FC08C | 8.0V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 185 K |
PKFC08C | 8.0V; 250Watts; packed flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 102 K |
U0402FC08C | 8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 162 K |
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