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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
U0404FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C107 K
U0406FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
U0406FC08C8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C111 K
U0408FC08C8.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C115 K
ULC0402FC08C8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0402--55°C150°C161 K
ULC0404FC08C8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0402--55°C150°C165 K
ULC0406FC08C8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributorU0406--55°C150°C169 K
ULC0408FC08C8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULLC0402FC08C8.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C159 K
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