| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| U0404FC08C | 8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 107 K |
| U0406FC08C | 8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 111 K |
| U0406FC08C | 8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 111 K |
| U0408FC08C | 8.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 115 K |
| ULC0402FC08C | 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0402 | - | -55°C | 150°C | 161 K |
| ULC0404FC08C | 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0402 | - | -55°C | 150°C | 165 K |
| ULC0406FC08C | 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | U0406 | - | -55°C | 150°C | 169 K |
| ULC0408FC08C | 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 172 K |
| ULLC0402FC08C | 8.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
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