Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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FC80960HA25SL2GU | 32-bit high-performance superscalar processor. Core speed 25 MHz, bus speed 25 MHz | Intel-Corporation | PQFP | 208 | 0°C | 85°C | 1 M |
FC80960HA33SL2GV | 32-bit high-performance superscalar processor. Core speed 33 MHz, bus speed 33 MHz | Intel-Corporation | PQFP | 208 | 0°C | 85°C | 1 M |
FC80960HA40SL2GW | 32-bit high-performance superscalar processor. Core speed 40 MHz, bus speed 40 MHz | Intel-Corporation | PQFP | 208 | 0°C | 85°C | 1 M |
FC80960HD32SL2GL | 32-bit high-performance superscalar processor. Core speed 32 MHz, bus speed 16 MHz | Intel-Corporation | PQFP | 208 | 0°C | 85°C | 1 M |
IXFC80N08 | 80V HiPerFET MOSFET | distributor | ISOPLUS220 | 3 | -55°C | 150°C | 68 K |
IXFC80N085 | 85V HiPerFET MOSFET | distributor | ISOPLUS220 | 3 | -55°C | 150°C | 68 K |
IXFC80N10 | 100V HiPerFET MOSFET | distributor | ISOPLUS220 | 3 | -55°C | 150°C | 70 K |
P0402FC8C | 8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 180 K |
P0402FC8C | 8.0V; 250Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 180 K |
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