| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| MG64PB34 | 0.25mm embedded DRAM/Customer Structured Array | distributor | QFP | 240 | -40°C | 85°C | 267 K |
| MG64PB34 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 352 | -40°C | 85°C | 267 K |
| MG64PB34 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 420 | -40°C | 85°C | 267 K |
| MG64PB34 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 560 | -40°C | 85°C | 267 K |
| MG64PB34 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 560 | -40°C | 85°C | 267 K |
| MG64PB36 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 144 | -40°C | 85°C | 267 K |
| MG64PB36 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 176 | -40°C | 85°C | 267 K |
| MG64PB36 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 208 | -40°C | 85°C | 267 K |
| MG64PB36 | 0.25mm embedded DRAM/Customer Structured Array | distributor | QFP | 208 | -40°C | 85°C | 267 K |
| MG64PB36 | 0.25mm embedded DRAM/Customer Structured Array | distributor | QFP | 240 | -40°C | 85°C | 267 K |
| << [6] [7] [8] [9] [10] 11 [12] [13] [14] [15] |
|---|
