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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
LAG640DIC for multifunction telefonesdistributor-30-20°C70°C300 K
MCM44G64BSG121MB R4000 secondary cache fast static RAM module setMotorolaSG800°C70°C103 K
MCM44G64BSG171MB R4000 secondary cache fast static RAM module setMotorolaSG800°C70°C103 K
MCM72JG64SG66256K and 512 bit pipelined burstRAM sedcondary cache moduleMotorolaGP1600°C70°C296 K
MG64PB020.25mm embedded DRAM/Customer Structured ArraydistributorTQFP100-40°C85°C267 K
MG64PB040.25mm embedded DRAM/Customer Structured ArraydistributorTQFP100-40°C85°C267 K
MG64PB080.25mm embedded DRAM/Customer Structured ArraydistributorTQFP100-40°C85°C267 K
MG64PB100.25mm embedded DRAM/Customer Structured ArraydistributorLQFP208-40°C85°C267 K
MG64PB100.25mm embedded DRAM/Customer Structured ArraydistributorQFP208-40°C85°C267 K
MG64PB100.25mm embedded DRAM/Customer Structured ArraydistributorTQFP100-40°C85°C267 K
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