| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| MG64PB28 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 352 | -40°C | 85°C | 267 K |
| MG64PB28 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 420 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 144 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 176 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | LQFP | 208 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | QFP | 208 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | QFP | 240 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 256 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 352 | -40°C | 85°C | 267 K |
| MG64PB30 | 0.25mm embedded DRAM/Customer Structured Array | distributor | BGA | 420 | -40°C | 85°C | 267 K |
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