Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
1MBH10D-060 | Fuji discrete package IGBT | distributor | - | 3 | - | - | 347 K |
1MBH10D-120 | Fuji discrete package IGBT | distributor | - | 3 | - | - | 4 M |
EH10002Z1 | 3 Phase Bridge | Microsemi-Corporation | SEE_FACTORY | - | - | - | 80 K |
EH10004Z1 | 3 Phase Bridge | Microsemi-Corporation | SEE_FACTORY | - | - | - | 80 K |
ILH100 | Hermetic phototransistor optocoupler | Infineon-formely-Siemens | DIP8 | 8 | -55°C | 125°C | 215 K |
KF2002-GH10A | Compact low speed thick film thermal printhead (8 dot/mm) | ROHM | - | 14 | 5°C | 45°C | 151 K |
KF2003-GH10A | Compact low speed thick film thermal printhead (8 dot/mm) | ROHM | - | 18 | 5°C | 45°C | 165 K |
KF2004-GH10A | Compact low speed thick film thermal printhead (8 dot/mm) | ROHM | - | 18 | 5°C | 45°C | 161 K |
KF2010-GH10A | Thick film thermal printhead (8 dot/mm) | ROHM | - | 18 | 5°C | 45°C | 164 K |
LH1056 | High voltage, solid state relay optocoupler | Infineon-formely-Siemens | DIP6 | 6 | -40°C | 85°C | 43 K |
<< [10] [11] [12] [13] [14] 15 [16] [17] [18] [19] [20] >> |
---|