| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962H9475402QLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962H9475402QLC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962H9475402QLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962H9475402QXC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| 5962H9475402QXX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. | distributor | FlatPack | 24 | -55°C | 125°C | 287 K |
| 5962H9475402VLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962H9475402VLA | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962H9475402VLC | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962H9475402VLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
| 5962H9475402VLX | Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. | distributor | DIP | 24 | -55°C | 125°C | 287 K |
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