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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962H9475404QLARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorDIP24-55°C125°C287 K
5962H9475404QLCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.distributorDIP24-55°C125°C287 K
5962H9475404QLXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.distributorDIP24-55°C125°C287 K
5962H9475404QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorFlatPack24-55°C125°C287 K
5962H9475404QXARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorFlatPack24-55°C125°C287 K
5962H9475404QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.distributorFlatPack24-55°C125°C287 K
5962H9475404QXCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.distributorFlatPack24-55°C125°C287 K
5962H9475404QYARadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.distributorQuad flatpack28-55°C125°C287 K
5962H9475404QYCRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.distributorQuad flatpack28-55°C125°C287 K
5962H9475404QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.distributorQuad flatpack28-55°C125°C287 K
5962H9475404QYXRadiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.distributorQuad flatpack28-55°C125°C287 K
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