| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT7207L15P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L20P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L20PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT7207L25P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L30PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT7207L35P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L50PB | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 148 K |
| IDT723613L20PQF | CMOS clocked FIFO with bus matching and byte swapping 64 x 36 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 342 K |
| IDT723613L30PQF | CMOS clocked FIFO with bus matching and byte swapping 64 x 36 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 342 K |
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