| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT723614L30PQF | CMOS syncBiFIFO with bus matching and byte swapping 64 x 36 x 2 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 499 K |
| IDT7280L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7280L25PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L15PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L25PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L25PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7282L15PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7282L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
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