Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7202LA120XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
IDT7202LA80XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
IDT72251L15J | CMOS syncFIFO 8192 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 183 K |
IDT72251L20J | CMOS syncFIFO 8192 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 183 K |
IDT72251L25J | CMOS syncFIFO 8192 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 183 K |
IDT72251L35J | CMOS syncFIFO 8192 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 183 K |
IDT72264L15G | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 392 K |
IDT72264L15G | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 392 K |
IDT72264L20G | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 392 K |
IDT72274L15G | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 392 K |
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