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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT72V36110L10PF3.3V, high-density, low power, 131072 x 36-bit FIFO, 10nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V36110L15PF3.3V, high-density, low power, 131072 x 36-bit FIFO, 15nsIntegrated-Device-Technology-Inc-TQFP1280°C70°C567 K
IDT72V851L10PF8192 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V851L10TF8192 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V851L15PF8192 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V851L15PF8192 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V851L15PFI8192 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-TQFP64-40°C85°C150 K
IDT72V851L15TF8192 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V851L15TFI8192 X 9 CMOS, 3.3 V dual SyncFIFO, 15nsIntegrated-Device-Technology-Inc-STQFP64-40°C85°C150 K
IDT72V851L20PF8192 X 9 CMOS, 3.3 V dual SyncFIFO, 20nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
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