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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT72V801L10TF256 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V811L10PF512 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V811L10TF512 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V821L10PF1024 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V821L10TF1024 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V831L10PF2048 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V831L10PF2048 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V841L10PF4096 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-TQFP640°C70°C150 K
IDT72V841L10TF4096 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
IDT72V851L10TF8192 X 9 CMOS, 3.3 V dual SyncFIFO, 10nsIntegrated-Device-Technology-Inc-STQFP640°C70°C150 K
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