| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT7207L20P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT72274L20TF | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | STQFP | 64 | 0°C | 70°C | 392 K |
| IDT723613L20PF | CMOS clocked FIFO with bus matching and byte swapping 64 x 36 | Integrated-Device-Technology-Inc- | PF | 120 | 0°C | 70°C | 342 K |
| IDT723613L20PQF | CMOS clocked FIFO with bus matching and byte swapping 64 x 36 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 342 K |
| IDT723614L20PF | CMOS syncBiFIFO with bus matching and byte swapping 64 x 36 x 2 | Integrated-Device-Technology-Inc- | PF | 120 | 0°C | 70°C | 499 K |
| IDT723614L20PQF | CMOS syncBiFIFO with bus matching and byte swapping 64 x 36 x 2 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 499 K |
| IDT7280L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7282L20PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
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