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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT707288L20GHigh-speed 64K x 16 bank-switchable dual-ported SRAM with external bank selectsIntegrated-Device-Technology-Inc-PGA1080°C70°C65 K
IDT707288L20PFHigh-speed 64K x 16 bank-switchable dual-ported SRAM with external bank selectsIntegrated-Device-Technology-Inc-TQFP1000°C70°C65 K
IDT707288L20PFHigh-speed 64K x 16 bank-switchable dual-ported SRAM with external bank selectsIntegrated-Device-Technology-Inc-TQFP1000°C70°C65 K
IDT71T016L200PHILow power 2V CMOS SRAM 1 meg (64K x 16-bit)Integrated-Device-Technology-Inc-TSOP44-40°C85°C80 K
IDT72251L20JCMOS syncFIFO 8192 x 9Integrated-Device-Technology-Inc-PLCC320°C70°C183 K
IDT72264L20GVariable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9Integrated-Device-Technology-Inc-PGA680°C70°C392 K
IDT72264L20PFVariable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9Integrated-Device-Technology-Inc-TQFP640°C70°C392 K
IDT72264L20TFVariable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9Integrated-Device-Technology-Inc-STQFP640°C70°C392 K
IDT72274L20GVariable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9Integrated-Device-Technology-Inc-PGA680°C70°C392 K
IDT72274L20PFVariable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9Integrated-Device-Technology-Inc-TQFP640°C70°C392 K
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