Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT707288L20G | High-speed 64K x 16 bank-switchable dual-ported SRAM with external bank selects | Integrated-Device-Technology-Inc- | PGA | 108 | 0°C | 70°C | 65 K |
IDT707288L20PF | High-speed 64K x 16 bank-switchable dual-ported SRAM with external bank selects | Integrated-Device-Technology-Inc- | TQFP | 100 | 0°C | 70°C | 65 K |
IDT707288L20PF | High-speed 64K x 16 bank-switchable dual-ported SRAM with external bank selects | Integrated-Device-Technology-Inc- | TQFP | 100 | 0°C | 70°C | 65 K |
IDT71T016L200PHI | Low power 2V CMOS SRAM 1 meg (64K x 16-bit) | Integrated-Device-Technology-Inc- | TSOP | 44 | -40°C | 85°C | 80 K |
IDT72251L20J | CMOS syncFIFO 8192 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 183 K |
IDT72264L20G | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 392 K |
IDT72264L20PF | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 392 K |
IDT72264L20TF | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | STQFP | 64 | 0°C | 70°C | 392 K |
IDT72274L20G | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 392 K |
IDT72274L20PF | Variable width supersync FIFO 8,192 x 18 or 16,384 x 9, 16,384 x 18 or 32,768 x 9 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 392 K |
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