| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT7203L25P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
| IDT7204L25P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
| IDT7205L25P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
| IDT7206L25P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
| IDT7207L25D | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7207L25J | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 148 K |
| IDT7207L25J | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 148 K |
| IDT7207L25P | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 148 K |
| IDT7281L25PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| IDT7281L25PA | CMOS dual asynchronous FIFO dual 256 x 9, dual 512 x 9, dual 1024 x 9 | Integrated-Device-Technology-Inc- | TSSOP | 56 | 0°C | 70°C | 142 K |
| << [28] [29] [30] [31] [32] 33 [34] [35] [36] [37] [38] >> |
|---|
