| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT7216L25F | 16x16 parallel CMOS multiplier | Integrated-Device-Technology-Inc- | FLATPACK | 64 | 0°C | 70°C | 249 K |
| IDT7216L25G | 16x16 parallel CMOS multiplier | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 249 K |
| IDT7217L25C | 16x16 parallel CMOS multiplier | Integrated-Device-Technology-Inc- | DIP | 64 | 0°C | 70°C | 249 K |
| IDT7217L25F | 16x16 parallel CMOS multiplier | Integrated-Device-Technology-Inc- | FLATPACK | 64 | 0°C | 70°C | 249 K |
| IDT7217L25G | 16x16 parallel CMOS multiplier | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 249 K |
| IDT7217L25J | 16x16 parallel CMOS multiplier | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 249 K |
| W24L257AQ-12 | 32K*8 high speed, low power CMOS static RAM | Winbond-Electronics | TSOP28 | 28 | 0°C | 70°C | 209 K |
| W24L257AQ-15 | 32K*8 high speed, low power CMOS static RAM | Winbond-Electronics | TSOP28 | 28 | 0°C | 70°C | 209 K |
| W24L257AQ-20 | 32K*8 high speed, low power CMOS static RAM | Winbond-Electronics | TSOP28 | 28 | 0°C | 70°C | 209 K |
| W741L250 | 4-bit microcontroller | Winbond-Electronics | QFP64 | 64 | 0°C | 70°C | 478 K |
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