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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
MCM32L256S10256Kx32 bit dynamic random access memory module. Fast access time 100ns.MotorolaSIMM720°C70°C545 K
MCM32L256S70256Kx32 bit dynamic random access memory module. Fast access time 70ns.MotorolaSIMM720°C70°C545 K
MCM32L256S80256Kx32 bit dynamic random access memory module. Fast access time 80ns.MotorolaSIMM720°C70°C545 K
MCM32L256SG10256Kx32 bit dynamic random access memory module. Fast access time 100ns.MotorolaGold pad SIMM720°C70°C545 K
MCM32L256SG70256Kx32 bit dynamic random access memory module. Fast access time 70ns.MotorolaGold pad SIMM720°C70°C545 K
MCM32L256SG70256Kx32 bit dynamic random access memory module. Fast access time 70ns.MotorolaGold pad SIMM720°C70°C545 K
T15L256A-70D70ns; -0.5 to 4.6V; 0.5W; 32 x 8 high speed CMOS static RAMdistributorSOP280°C70°C83 K
T15L256A-70D70ns; -0.5 to 4.6V; 0.5W; 32 x 8 high speed CMOS static RAMdistributorSOP280°C70°C83 K
T15L256A-70P70ns; -0.5 to 4.6V; 0.5W; 32 x 8 high speed CMOS static RAMdistributorTSOP280°C70°C83 K
T15L256A-70P70ns; -0.5 to 4.6V; 0.5W; 32 x 8 high speed CMOS static RAMdistributorTSOP280°C70°C83 K
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