| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT71256L30DB | CMOS static RAM 256K (32K x 8-bit) | Integrated-Device-Technology-Inc- | CERDIP | 28 | -55°C | 125°C | 78 K |
| IDT71256L30PB | CMOS static RAM 256K (32K x 8-bit) | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 78 K |
| IDT71256L30TDB | CMOS static RAM 256K (32K x 8-bit) | Integrated-Device-Technology-Inc- | CERDIP | 28 | -55°C | 125°C | 78 K |
| IDT71256L30YB | CMOS static RAM 256K (32K x 8-bit) | Integrated-Device-Technology-Inc- | SOJ | 28 | -55°C | 125°C | 78 K |
| IDT7164L30DB | CMOS static RAM 64K (8K x 8-bit) | Integrated-Device-Technology-Inc- | CERDIP | 28 | -55°C | 125°C | 104 K |
| IDT7164L30TDB | CMOS static RAM 64K (8K x 8-bit) | Integrated-Device-Technology-Inc- | CERDIP | 28 | -55°C | 125°C | 104 K |
| IDT7164L30TPB | CMOS static RAM 64K (8K x 8-bit) | Integrated-Device-Technology-Inc- | DIP | 28 | -55°C | 125°C | 104 K |
| IDT723622L30PQF | CMOS syncBiFIFO 256 x 36 x 2, 512 x 36 x 2, 1024 x 36 x 2 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 294 K |
| IDT723632L30PQF | CMOS syncBiFIFO 256 x 36 x 2, 512 x 36 x 2, 1024 x 36 x 2 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 294 K |
| IDT723642L30PQF | CMOS syncBiFIFO 256 x 36 x 2, 512 x 36 x 2, 1024 x 36 x 2 | Integrated-Device-Technology-Inc- | PQFP | 132 | 0°C | 70°C | 294 K |
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