Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7006L35F | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | FLATPACK | 68 | 0°C | 70°C | 263 K |
IDT7006L35FB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | FLATPACK | 68 | -55°C | 125°C | 263 K |
IDT7006L35J | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 263 K |
IDT7006L35JB | High-speed 16K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PLCC | 68 | -55°C | 125°C | 263 K |
IDT72031L35G | CMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9 | Integrated-Device-Technology-Inc- | CERDIP | 32 | 0°C | 70°C | 153 K |
IDT72041L35G | CMOS asynchronous FIFO with retransmit 1K x 9,2K x 9,4K x 9 | Integrated-Device-Technology-Inc- | CERDIP | 32 | 0°C | 70°C | 153 K |
IDT72605L35G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72605L35PF | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 209 K |
IDT72615L35G | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 209 K |
IDT72615L35J | CMOS syncBiFIFO 256 x 18 x 2 and 512 x 18 x 2 | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 209 K |
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