Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
IDT7203L50TDB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7204L50TD | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
IDT7204L50TDB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7205L50J | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 147 K |
IDT7205L50JB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | -55°C | 125°C | 147 K |
IDT7205L50JB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | -55°C | 125°C | 147 K |
IDT7205L50TD | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
IDT7205L50TDB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7206L50J | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 147 K |
IDT7206L50JB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | -55°C | 125°C | 147 K |
<< [11] [12] [13] [14] [15] 16 [17] [18] [19] [20] [21] >> |
---|