Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7203L50D | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7203L50TP | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
IDT7203L50TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7204L50TP | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
IDT7204L50TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7205L50TP | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
IDT7205L50TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
IDT7206L50P | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | DIP | 28 | 0°C | 70°C | 147 K |
IDT7206L50TP | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | 0°C | 70°C | 147 K |
IDT7206L50TPB | CMOS asynchronous FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9 | Integrated-Device-Technology-Inc- | THINDIP | 28 | -55°C | 125°C | 147 K |
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