Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7201LA20L | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | 0°C | 70°C | 152 K |
IDT7201LA20LB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 152 K |
IDT7201LA20XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
IDT7201LA25L | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | 0°C | 70°C | 152 K |
IDT7202LA20L | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | 0°C | 70°C | 152 K |
IDT7202LA20LB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 152 K |
IDT7202LA20SO | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 152 K |
IDT7202LA20SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
IDT7202LA25L | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | 0°C | 70°C | 152 K |
IDT7202LA25SO | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | 0°C | 70°C | 152 K |
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