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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
IDT7200LA30JBCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC32-55°C125°C152 K
IDT7200LA30SOBCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC28-55°C125°C152 K
IDT7200LA35JCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC320°C70°C152 K
IDT7200LA35SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7200LA35SOCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-SOIC280°C70°C152 K
IDT7201LA30JBCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC32-55°C125°C152 K
IDT7201LA35JCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC320°C70°C152 K
IDT7202LA30JBCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC32-55°C125°C152 K
IDT7202LA35JCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-PLCC320°C70°C152 K
IDT7202LA35TDCMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9Integrated-Device-Technology-Inc-THINDIP280°C70°C152 K
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