| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT6116LA45P | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | 0°C | 70°C | 91 K |
| IDT6116LA45PB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
| IDT6116LA45TDB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | CERDIP | 24 | -55°C | 125°C | 91 K |
| IDT6116LA45TP | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | 0°C | 70°C | 91 K |
| IDT6116LA45TPB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
| IDT6167LA45DB | CMOS static RAM 16K (16K x 1-bit) | Integrated-Device-Technology-Inc- | CERDIP | 20 | -55°C | 125°C | 63 K |
| IDT6167LA45PB | CMOS static RAM 16K (16K x 1-bit) | Integrated-Device-Technology-Inc- | DIP | 20 | -55°C | 125°C | 63 K |
| IDT6167LA45YB | CMOS static RAM 16K (16K x 1-bit) | Integrated-Device-Technology-Inc- | SOJ | 20 | -55°C | 125°C | 63 K |
| IDT7201LA40XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
| IDT7201LA40XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
| IDT7202LA40XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
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