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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
ULC0408FC05C5.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC08C8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC12C12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC15C15.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC24C24.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULC0408FC3.3C3.3V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C172 K
ULLC0402FC05C5.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C159 K
ULLC0402FC08C8.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C159 K
ULLC0402FC12C12.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C159 K
ULLC0402FC3.3C3.3V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cardsdistributor---55°C150°C159 K
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