| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| LX9501 | Backlight Cable Assembly | Microsemi-Corporation | Cable_Assembly | - | - | - | 34 K |
| LX9502 | Backlight Cable Assembly | Microsemi-Corporation | Cable_Assembly | - | - | - | 37 K |
| LX9506 | Backlight Cable Assembly | Microsemi-Corporation | CABLE_ASSEMBLY | - | - | - | 33 K |
| LX9507 | Backlight Cable Assembly | Microsemi-Corporation | CABLE_ASSEMBLY | - | - | - | 34 K |
| MLX90108D | 64-bit read only transponder. With gold bumps | distributor | SOIC | 8 | -40°C | 85°C | 94 K |
| MLX90108D | 64-bit read only transponder. With gold bumps | distributor | Sawed wafer on frame | 8 | -40°C | 85°C | 94 K |
| MLX90108D | 64-bit read only transponder. With gold bumps | distributor | Bare die in blistert | 8 | -40°C | 85°C | 94 K |
| MLX90108E | 64-bit read only transponder. Without gold bumps | distributor | SOIC | 8 | -40°C | 85°C | 94 K |
| MLX90108E | 64-bit read only transponder. Without gold bumps | distributor | Sawed wafer on frame | 8 | -40°C | 85°C | 94 K |
| MLX90108E | 64-bit read only transponder. Without gold bumps | distributor | Bare die in blistert | 8 | -40°C | 85°C | 94 K |
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