Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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KM684000ALG-7 | 70ns, 512Kx8 bit low power CMOS static RAM | Samsung-Electronic | SOP | 32 | 0°C | 70°C | 190 K |
KM684000ALGI-7 | 70ns, 512Kx8 bit low power CMOS static RAM | Samsung-Electronic | SOP | 32 | -40°C | 85°C | 190 K |
KM684000ALGI-7L | 70ns, 512Kx8 bit low low power CMOS static RAM | Samsung-Electronic | SOP | 32 | -40°C | 85°C | 190 K |
KM684000ALR-5L | 55ns, 512Kx8 bit low low power CMOS static RAM | Samsung-Electronic | - | 32 | 0°C | 70°C | 190 K |
KM684000ALR-7L | 70ns, 512Kx8 bit low low power CMOS static RAM | Samsung-Electronic | - | 32 | 0°C | 70°C | 190 K |
KM684000ALRI-7L | 70ns, 512Kx8 bit low low power CMOS static RAM | Samsung-Electronic | - | 32 | -40°C | 85°C | 190 K |
KM684000ALT-5L | 55ns, 512Kx8 bit low low power CMOS static RAM | Samsung-Electronic | - | 32 | 0°C | 70°C | 190 K |
KM684000ALTI-7L | 70ns, 512Kx8 bit low low power CMOS static RAM | Samsung-Electronic | - | 32 | -40°C | 85°C | 190 K |
OR3LP26BM680C | ORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28. | distributor | PBGAM | 680 | 0°C | 70°C | 5 M |
OR3LP26BM680I | ORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28. | distributor | PBGAM | 680 | -40°C | 85°C | 5 M |
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