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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
KM684000ALG-770ns, 512Kx8 bit low power CMOS static RAMSamsung-ElectronicSOP320°C70°C190 K
KM684000ALGI-770ns, 512Kx8 bit low power CMOS static RAMSamsung-ElectronicSOP32-40°C85°C190 K
KM684000ALGI-7L70ns, 512Kx8 bit low low power CMOS static RAMSamsung-ElectronicSOP32-40°C85°C190 K
KM684000ALR-5L55ns, 512Kx8 bit low low power CMOS static RAMSamsung-Electronic-320°C70°C190 K
KM684000ALR-7L70ns, 512Kx8 bit low low power CMOS static RAMSamsung-Electronic-320°C70°C190 K
KM684000ALRI-7L70ns, 512Kx8 bit low low power CMOS static RAMSamsung-Electronic-32-40°C85°C190 K
KM684000ALT-5L55ns, 512Kx8 bit low low power CMOS static RAMSamsung-Electronic-320°C70°C190 K
KM684000ALTI-7L70ns, 512Kx8 bit low low power CMOS static RAMSamsung-Electronic-32-40°C85°C190 K
OR3LP26BM680CORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28.distributorPBGAM6800°C70°C5 M
OR3LP26BM680IORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28.distributorPBGAM680-40°C85°C5 M
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