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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
MH16S64APFC-71073741824-bit (16777216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1440°C70°C676 K
MH16S64APFC-7L1073741824-bit (16777216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1440°C70°C676 K
MH16S64APFC-81073741824-bit (16777216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1440°C70°C676 K
MH16V7245BATJ-51,207,959,552-bit (16,777,216-word by 72-bit) dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C152 K
MH16V7245BATJ-61,207,959,552-bit (16,777,216-word by 72-bit) dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C152 K
MH16V7245BWJ-61,207,959,552-bit (16,777,216-word by 72-bit) dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C129 K
MH16V725BATJ-51,207,959,552-bit (16,777,216-word by 72-bit) dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C149 K
MH16V725BATJ-61,207,959,552-bit (16,777,216-word by 72-bit) dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C149 K
MH16V725BWJ-51,207,959,552-bit (16,777,216-word by 72-bit) dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C129 K
MH16V725BWJ-61,207,959,552-bit (16,777,216-word by 72-bit) dynamic DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C129 K
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