| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| HPMX-5001-STR | 1.5-2.5 GHz upconverter, downconverter | distributor | - | 32 | - | - | 171 K |
| HPMX-5001-TR1 | 1.5-2.5 GHz upconverter, downconverter | distributor | - | 32 | - | - | 171 K |
| HPMX-5001-TY1 | 1.5-2.5 GHz upconverter, downconverter | distributor | - | 32 | - | - | 171 K |
| HPMX-5002-STR | IF modulator, demodulator IC | distributor | - | 48 | - | - | 162 K |
| HPMX-5002-TR1 | IF modulator, demodulator IC | distributor | - | 48 | - | - | 162 K |
| HPMX-5002-TY1 | IF modulator, demodulator IC | distributor | - | 48 | - | - | 162 K |
| HPMX-5002-TY1 | IF modulator, demodulator IC | distributor | - | 48 | - | - | 162 K |
| LM70CIMMX-5 | SPI/MICROWIRE10-Bit plus Sign Digital Temperature Sensor | distributor | MINI SOIC | 8 | -40°C | 150°C | 285 K |
| LM70CIMMX-5 | SPI/MICROWIRE10-Bit plus Sign Digital Temperature Sensor | distributor | MINI SOIC | 8 | -40°C | 150°C | 285 K |
| MX-5 | Relay. Coil voltage 5 VDC. Sealed cover. Contact arrangement 1 Form A. | distributor | - | - | -40°C | 85°C | 46 K |
| MX-5G | Relay. Low level loads. Coil voltage 5 VDC. Sealed cover. Contact arrangement 1 Form A. | distributor | - | - | -40°C | 85°C | 46 K |
| [1] [2] [3] 4 [5] |
|---|
