Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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TISP3320F3D | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | D | - | - | - | 457 K |
TISP3320F3DR | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | DR | - | - | - | 457 K |
TISP3320F3P | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | P | - | - | - | 457 K |
TISP3320F3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 457 K |
TISP3380F3D | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | D | - | - | - | 457 K |
TISP3380F3DR | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | DR | - | - | - | 457 K |
TISP3380F3P | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | P | - | - | - | 457 K |
UPD75P336GC-3B9 | 4-bit single-chip microcomputer | NEC-Electronics-Inc- | - | - | - | - | 531 K |
UPD75P336GK-BE9 | 4-bit single-chip microcomputer | NEC-Electronics-Inc- | - | - | - | - | 531 K |
UPD75P336GK-XXX-BE9 | 4-bit single-chip microcomputer | NEC-Electronics-Inc- | - | - | - | - | 531 K |
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