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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
MH16S64APHB-61073741824-bit (16777216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C688 K
MH16S64APHB-71073741824-bit (16777216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C688 K
MH16S64APHB-81073741824-bit (16777216-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C688 K
MH16S72APHB-61207959552-bit (16777216-word by 72-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C691 K
MH16S72APHB-81207959552-bit (16777216-word by 72-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C691 K
MH32S64APHB-62147483648-bit (33554432-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C699 K
MH32S64APHB-72147483648-bit (33554432-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C699 K
MH32S64APHB-82147483648-bit (33554432-word by 64-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C699 K
MH32S72APHB-62415919104-bit (33554432-word by 72-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-GroupTSOP1680°C70°C703 K
MH32S72PHB-102,415,919,104-bit (33,554,432-word by 72-bit) synchronous DRAMMitsubishi-Electric-Corporation-Semiconductor-Group--0°C70°C595 K
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